The Master of Science in Technology and Design (IC Design, Failure Analysis and Reliability) programme is designed to address the growing demand for skilled professionals in the semiconductor industry who possess not only advanced theoretical knowledge but also practical experience. This programme aims to give students an all-encompassing knowledge and experience in the fields of semiconductor device technologies and architectures, digital integrated circuit design, semiconductor materials analysis, device and integrated circuit reliability and failure analysis for production yield improvement.
Developed in collaboration with Wintech-Nano Technology, a leading expert in semiconductor chip analysis and testing, the programme offers a standout feature: a two-month internship during the final term at Wintech’s cutting-edge facilities in Suzhou, China. This extraordinary opportunity allows students to learn through practical engagement, preparing students effectively for your future career in the semiconductor domain.
Extra Notes
* NOTE : The Tuition Fee is subject to change Semester wise, as such for exact Tuition Fee kindly see the Website of the respective University.
* NOTE : Pathways : Students who want to pursue a Graduate Degree through a particular University but are unable to meet the university requirements for the GPA, GRE/GMAT or English Language scores, have to take up an additional academic and language support i.e. pathways in order to ensure the admit and study at the desired University.
